The advantages of s.mask at a glance

For assemblers and users of electronic components, s.mask has enormous advantages over the solder resist masks previously used, for example, in the areas of accuracy and tolerances as well as the general protective function.

In addition, s.mask offers entirely new possibilities for the implementation of specific product requirements regarding dielectric strength and the design of “solder-mask-defined pads”, as well as for the design of individual decors and markings, such as are used for traceability.

The outstanding advantages can be seen especially in the areas of:

Precision

  • Customer-specific definable dielectric strength through fixed and μm-accurate layer thicknesses
  • High positioning accuracy
  • Representation of modelled solder resist barriers
  • Different layer thicknesses possible in one layout
  • High degrees of freedom in the design of HF layouts are possible
  • Optical referencing of individual structures is also possible

Performance

  • Possibility of 100% traceability via individual labelling
  • Higher soldering quality as no organic residues remain on the solder pads
  • Consequently, chemically cleaner quality of the surface coating and hence the soldered joint
  • Creation of the finest structures (space)
  • Function-defined layer thicknesses are possible
  • Improved sustainability in terms of energy & solvent use
  • No solder resist mask residues in bore holes
  • Defined gloss levels and various haptics (also partial) are possible

Protection

  • Corrosion protection of the pad flanks: The protective surface extends directly to the copper pad
  • Protection against infiltration of solder surfaces. This prevents infiltration and the break-up of stop mask as a result of humidity.
  • Prevention of surface disturbances due to stop mask residues in bore holes: The homogeneous mask layer has a “smoother” surface without depressions and grooves and therefore offers less attack surface for organic residues => no undercut, no chemicals and dirt residues.